TESCAN | Dependable Way to the Thinnest Specimens: AMBER 2 with Gentle Ion Beam for High-Precision TEM Workflows
Wednesday, July 30, 2025
5:45 PM - 6:45 PM MT
Location: Exhibit Hall BCDE
Booth 1324
Discover how AMBER 2 delivers damage-free lamella prep using AURA™ Gentle Ion Beam technology. Fully integrated Ar milling ensures high-quality final thinning for demanding STEM/TEM applications. Automation ensures consistency and ease of use in multi-user environments. Optimized for labs where throughput, precision and repeatability in sample preparation are critical. Target Audience: STEM/TEM users, Sample prep experts, Core facilities and academic labs, STEM/TEM Specialists