
Presenting Author: Colin Ophus (he/him/his)
Co-Author: Stephanie Ribet (she/her/hers) – Lawrence Berkeley National Laboratory
Co-Author: Karen Bustillo – Lawrence Berkeley National Laboratory
Presenting Author: Zixiao Shi – Cornell University
Co-Author: Desheng Ma – School of Applied and Engineering Physics, Cornell University
Co-Author: Madison I. Bardot – Northwestern Univeristy
Co-Author: William Dichtel – Northwestern Univeristy
Co-Author: David A. Muller (he/him/his) – Cornell University
Presenting Author: Guanxing Li (he/him/his) – Cornell University
Co-Author: Shoucong Ning (he/him/his) – University of Science and Technology of China
Co-Author: Hui Zhang (he/him/his) – South China University of Technology
Co-Author: Chia-Hao Lee (he/him/his) – Cornell University
Co-Author: David A. Muller (he/him/his) – Cornell University
Co-Author: Yu Han (he/him/his) – South China University of Technology
Presenting Author: Gabriel T. dos santos (he/him/his) – Northwestern University
Co-Author: Vinayak P. Dravid – Northwestern University
Co-Author: Roberto dos Reis, Ph.D – Northwestern University
Presenting Author: Liqi Zhou, Ph.D (she/her/hers) – Institute of Materiobiology, College of Science, Shanghai University
Co-Author: Yu Lei (he/him/his) – University of warwick
Co-Author: Wei Mao (he/him/his) – National Laboratory of Solid-State Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences and Collaborative Innovation Centre of Advanced Microstructures, Nanjing University
Co-Author: Chen Huang, Ph.D (he/him/his) – The Rosalind Franklin Institute, Harwell Campus, Didcot
Co-Author: Judy Kim, Ph.D (she/her/hers) – The Rosalind Franklin Institute, Harwell Campus
Co-Author: Si Gao, Ph.D (he/him/his) – College of Materials Science and Engineering, Nanjing Tech University
Co-Author: Yuefeng Nie, Ph.D (he/him/his) – National Laboratory of Solid-State Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences and Collaborative Innovation Centre of Advanced Microstructures, Nanjing University
Co-Author: Angus Kirkland, Ph.D (he/him/his) – Department of Materials, University of Oxford
Co-Author: Peng Wang, Ph.D – Department of Physics, University of Warwick
Co-Author: Xiaopeng Wu (he/him/his) – Department of Physics, University of Warwick