Analytical Sciences Symposia

Multi-Modal Approach for Quality Control and Failure Analysis of Metal Lines for Chiplets Integration

Presenting Author(s)

• 

  Kerim Tugrul Arat, PhD (he/him/his)

  Quantum Design Inc.
  San Diego, CA, United States

Co-Author(s)

• DJ

  Darshit Jangid

  Quantum Design Microscopy GmbH, Germany
• HF

  Hajo Frerichs, Ph.D.

  Application Specialist
  Quantum Design Microscopy GmbH, Germany
• WN

  William Neils, Ph.D.

  Quantum Design Inc., California, United States
• ss

  stefano spagna, Ph.D.

  Quantum Design Inc.
  San Diego, California, United States