Cross-Disciplinary Symposia

Microscopic Insights into Strain and Failure Mechanisms in Advanced Semiconductor Packaging

Presenting Author(s)

• 

  Pawel Nowakowski, PhD

  Senior Scientist
  E. A. Fischione Instruments, Inc.
  Export, PA, United States

Co-Author(s)

• RL

  Richard Li

  Sales/Service Manager for Taiwan
  E. A. Fischione Instruments, Inc.
  Export, Pennsylvania, United States
• MR

  Mary Ray

  Marketing and Communications Manager
  E. A. Fischione Instruments, Inc.
  Export, Pennsylvania, United States
• PF

  Paul Fischione

  CEO
  E. A. Fischione Instruments, Inc.
  Export, Pennsylvania, United States